CY8C201A0_12 CYPRESS [Cypress Semiconductor], CY8C201A0_12 Datasheet - Page 17

• Manufacturer Part Number: CY8C201A0_12
• Manufacturer: CYPRESS [Cypress Semiconductor]

Table 2. Layout Guidelines and Best Practices
Document Number: 001-54607 Rev. *G
S. No.
10
12
13
14
15
16
17
18
19
20
21
22
23
25
26
11
1
2
3
4
5
6
7
8
9
Button shape
Button size
Button-button spacing
Button ground clearance
Slider segment pattern
Saw tooth pattern
Number of slider segments
Slider segment size
Slider segment spacing
Ground flood - top layer
Ground flood - bottom layer
Trace length from sensor to
PSoC buttons
Trace width
Trace routing
Via position for the sensors
Via hole size for sensor traces
Number of vias on sensor trace
CapSense series resistor
placement
Distance between any CapSense
trace to ground flood
Device placement
Placement of components in 2
layer PCB
Placement of components in 4
layer PCB
Overlay material
Overlay adhesives
LED back lighting
Board thickness
Category
clearance
0.17 mm
Equal to
0.5 mm
0.5 mm
ground
button
10 mil
5 mm
2 mm
Min
–
5
–
–
–
–
–
–
1
–
–
–
–
–
–
–
–
0.20 mm
200 mm
15 mm
10 mm
20 mil
2 mm
5 mm
2 mm
Max
10
–
–
–
–
–
–
–
2
–
–
–
–
–
–
–
Solid round pattern, round with LED hole, rectangle with round
Design can have one 5 segment slider or one 10 segment slider
Hatched ground 7 mil trace and 45 mil grid (15% filling)
Traces should be routed on the non sensor side. If any non
Via should be placed near the edge of the button/slider to
Adhesive should be non conductive and dielectrically
Standard board thickness for CapSense FR4 based designs is
corners
10 mm
8 mm [X]
Button ground clearance = overlay thicknesses
2 mm
Slider segment spacing = overlay thickness
Hatched ground 7 mil trace and 70 mil grid (10% filling)
< 100 mm.
0.17 mm (7 mil)
CapSense trace crosses CapSense trace, ensure that
intersection is orthogonal.
reduce trace length thereby increasing sensitivity.
10 mil
1
Place CapSense series resistors close to the device for noise
suppression.CapSense resistors have highest priority place
them first.
20 mil
Mount the device on the layer opposite to sensor. The
CapSense trace length between the device and sensors should
be minimum.
Top layer sensor pads and bottom layer PSoC, other
components and traces.
Top layer – sensor pads,
second layer – CapSense traces,
third layer-hatched ground,
bottom layer – PSoC, other components and non CapSense
traces
Should be non-conductive material (glass, ABS plastic,
formica)
homogenous. 467 MP and 468 MP adhesives made by 3M are
recommended.
Cut a hole in the sensor pad and use rear mountable LEDs.
Refer to the PCB layout in the following diagrams.
1.6 mm.
Recommendations/Remarks
CY8C201A0
Page 17 of 38