M24C64-W STMICROELECTRONICS [STMicroelectronics], M24C64-W Datasheet - Page 33

• Manufacturer Part Number: M24C64-W
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24C64-W M24C64-R M24C64-F M24C64-DF
9
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 16. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 18.
1. Values in inches are converted from mm and rounded to four decimal digits.
Symbol
CP
A1
A2
E1
L1
D
A
E
b
c
e
L
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
TSSOP8 – 8-lead thin shrink small outline, package mechanical data
1.000
3.000
0.650
6.400
4.400
0.600
1.000
Typ.
millimeters
Doc ID 16891 Rev 27
0.050
0.800
0.190
0.090
2.900
6.200
4.300
0.450
Min.
0°
–
1.200
0.150
1.050
0.300
0.200
0.100
3.100
6.600
4.500
0.750
Max.
8°
–
0.0394
0.1181
0.0256
0.2520
0.1732
0.0236
0.0394
Typ.
Package mechanical data
inches
0.0020
0.0315
0.0075
0.0035
0.1142
0.2441
0.1693
0.0177
Min.
0°
–
(1)
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
0.2598
0.1772
0.0295
Max.
8°
–
33/42
®