M24C64-W STMICROELECTRONICS [STMicroelectronics], M24C64-W Datasheet - Page 37

• Manufacturer Part Number: M24C64-W
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 20. WLCSP-R 5-bump wafer-length chip-scale package outline
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 22.
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
Symbol
aaa
eee
b
A1
A2
e1
e2
D
G
A
E
F
e
WLCSP-R 5-bump wafer-length chip-scale package mechanical data
(2)
0.3465
Doc ID 16891 Rev 27
0.545
0.190
0.355
0.270
0.959
1.073
0.693
0.400
0.280
0.190
Typ
millimeters
0.110
0.060
0.490
Min
0.600
1.074
1.168
Max
0.0215
0.0075
0.0140
0.0106
0.0378
0.0422
0.0273
0.0157
0.0136
0.0110
0.0075
Typ
Package mechanical data
inches
0.0193
Min
(1)
0.0236
0.0423
0.0460
0.0043
0.0024
Max
37/42