AM29F200B AMD [Advanced Micro Devices], AM29F200B Datasheet - Page 6
![no-image](/images/no-image-200.jpg)
AM29F200B
Manufacturer Part Number
AM29F200B
Description
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1
Manufacturer
AMD [Advanced Micro Devices]
Datasheet
1.AM29F200B.pdf
(11 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM29F200B-120EC
Manufacturer:
AMD
Quantity:
18 831
Part Number:
AM29F200B-120EC
Manufacturer:
AMD
Quantity:
20 000
Company:
Part Number:
AM29F200B-75FC
Manufacturer:
AMD
Quantity:
258
Part Number:
AM29F200B-75FC
Manufacturer:
AMD
Quantity:
20 000
Company:
Part Number:
AM29F200BB-120EI
Manufacturer:
SPANSION
Quantity:
5 969
Company:
Part Number:
AM29F200BB-120SE
Manufacturer:
SPANSION
Quantity:
373
Company:
Part Number:
AM29F200BB-120SE
Manufacturer:
AMD
Quantity:
157
Part Number:
AM29F200BB-70ED
Manufacturer:
AMD
Quantity:
20 000
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
AM29F200BT-75,
AM29F200BB-75
(70 ns, V
AM29F200BT-90,
AM29F200BB-90
AM29F200BT-120,
AM29F200BB-120
Am29F200B
CC
= 5.0 V ±5%)
T
Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am29F200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit
5.0 Volt-only Program and Erase
-75
DP
DWC 1, DWI 1, DWE 1
DGC 1, DGI 1, DGE 1,
DPC 1, DPI 1, DPE 1,
DTC 1, DTI 1, DTE 1,
C
1
Am29F200B Known Good Die
S U P P L E M E N T
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C
I
E
Contact AMD for higher temperature range devices.
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
DG
DT
DW
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
=
=
=
=
=
=
=
Commercial (0°C to +70°C)
Industrial (–40
Extended (–55
Waffle Pack
245 die per 5 tray stack
Gel-Pak® Die Tray
486 die per 6 tray stack
Surftape™ (Tape and Reel)
2500 per 7-inch reel
Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
)
Top sector
Bottom sector
CMOS Flash Memory—Die Revision 1
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
°
°
C to +85
C to +125
°
C)
°
C)
Valid Combinations
5