AM29F200B AMD [Advanced Micro Devices], AM29F200B Datasheet - Page 9

• Manufacturer Part Number: AM29F200B
• Description: 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1
• Manufacturer: AMD [Advanced Micro Devices]

PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 135 mils x 150 mils
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . 19.7 mils
Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
Pad Area Free of Passivation . . . . . . . . . .13.99 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias:
Commercial, Industrial, and
Extended Temperature Range . . . . .T
Operating Temperature
Contact AMD for higher temperature range devices.
8
. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.43 mm x 3.81 mm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 µm x 115.9 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm
CC
Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
(Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
may be grounded (optional)
J
(max) = 130°C
Am29F200B Known Good Die
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . Sunnyvale, CA, USA,
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98480AK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
. . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia
(Bottom Boot) . . . . . . . .98480ABK