MAX11156ETC+ Maxim Integrated, MAX11156ETC+ Datasheet - Page 2

• Manufacturer Part Number: MAX11156ETC+
• Description: Analog to Digital Converters - ADC 18Bit 500ksps 5V SAR ADC w/Internal Ref
• Manufacturer: Maxim Integrated

Specifications of MAX11156ETC+

• Rohs: yes
• Number Of Channels: 1
• Architecture: SAR
• Conversion Rate: 500 KSPs
• Resolution: 18 bit
• Input Type: Pseudo-Differential
• Snr: 94.6 dB
• Interface Type: SPI
• Operating Supply Voltage: 2.3 V to 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TDFN-12
• Maximum Power Dissipation: 38.5 W
• Minimum Operating Temperature: - 40 C
• Number Of Converters: 1

MAX11156
Absolute Maximum Ratings
V
OVDD to GND ....... -0.3V to the lower of (V
AIN+ to GND ........................................................................ Q7V
AIN-, REF, REFIO, AGNDS
SCLK, DIN, DOUT, CNVST
Maximum Current into Any Pin...........................................50mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics
TDFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Electrical Characteristics
(V
otherwise noted. Typical values are at T
www.maximintegrated.com
ANALOG INPUT (Note 3)
Input Voltage Range
Absolute Input Voltage Range
Input Leakage Current
Input Capacitance
Input-Clamp Protection Current
DC ACCURACY (Note 4)
Resolution
No Missing Codes
Offset Error
Offset Temperature Coefficient
Gain Error
Gain Error Temperature
Coefficient
Integral Nonlinearity
Differential Nonlinearity
Positive Full-Scale Error
Negative Full-Scale Error
DD
DD
to GND ............... -0.3V to the lower of (V
to GND ............... -0.3V to the lower of (V
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
to GND ............................................................-0.3V to +6V
= 4.75V to 5.25V, V
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
OVDD
= 2.3V to 5.25V, f
SYMBOL
DNL
A
N
= +25NC.) (Note 2)
JC
DD
DD
DD
) ............22.5°C/W
JA
+ 0.3V) and +6V
+ 0.3V) and +6V
+ 0.3V) and +6V
)........59.3°C/W
AIN+ to AIN-, K = 5.0/4.096
AIN+ to GND
AIN- to GND
Acquisition phase
Both inputs
T
T
SAMPLE
A
A
= T
= +25°C to +85°C
(Note 1)
MIN
= 500kHz, V
CONDITIONS
to T
MAX
Continuous Power Dissipation (T
Operating Temperature Range ........................... -40NC to +85NC
Junction Temperature ......................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................. +300NC
Soldering Temperature (reflow) .......................................+260NC
REF
TDFN (derate 18.2mW/NC above +70NC) ..................1349mW
= 4.096V, Reference Mode 3; T
with Internal Reference in TDFN
18-Bit, 500ksps, ±5V SAR ADC
-K x V
-(V
MIN
0.1)
-0.1
-1.5
-0.9
-10
-20
-40
-40
-55
-45
18
18
-8
-6
DD
REF
+
+0.001
TYP
±0.1
±2.6
±2.4
±2.5
±2.5
±0.5
A
15
±8
±1
= +70NC)
A
= T
+K x V
+(V
Maxim Integrated │ 2
MIN
MAX
+0.1
+1.5
+0.9
0.1)
+10
+20
+40
+40
+55
+45
+8
+6
DD
REF
to T
+
MAX
ppm/°C
UNITS
µV/°C
LSB
LSB
LSB
LSB
LSB
LSB
, unless
Bits
Bits
mA
mV
µA
pF
V
V