IS61LV6416-10TL ISSI, Integrated Silicon Solution Inc, IS61LV6416-10TL Datasheet - Page 13

• Manufacturer Part Number: IS61LV6416-10TL
• Description: IC SRAM 1MBIT 10NS 44TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: Asynchronousr

Specifications of IS61LV6416-10TL

• Memory Size: 1M (64K x 16)
• Package / Case: 44-TSOP II
• Interface: Parallel
• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Speed: 10ns
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: 10 ns
• Supply Voltage (max): 3.63 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Current: 120 mA
• Organization: 64 K x 16
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Ports: 1
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 706-1039

400-mil Plastic SOJ
Package Code: K
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
10/29/03
No. Leads (N)
Symbol
A1
A2
E1
E2
N
A
B
C
D
E
b
e
1
Min
Millimeters
18.29 18.54
11.05 11.30
10.03 10.29
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
e
Max
3.75
0.51
0.81
0.33
—
—
28
D
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.720 0.730
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
Max
—
—
B
N/2
N/2+1
b
20.82 21.08
10.03 10.29
11.05 11.30
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
A
E1
A1
Max
1-800-379-4774
—
—
3.75
0.51
0.81
0.33
32
E
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
SEATING PLANE
Max
—
—
23.37 23.62
11.05 11.30
10.03 10.29
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
E2
Notes:
1. Controlling dimension:
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Reference document: JEDEC
MS-027.
millimeters.
between centers.
the bottom of the package.
and should be measured from
include mold flash protrusions
Max
3.75
0.51
0.81
0.33
—
—
ISSI
36
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.920 0.930
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Inches
C
Max
A2
—
—
®