LTC3809EMSE-1 Linear Technology, LTC3809EMSE-1 Datasheet - Page 22

• Manufacturer Part Number: LTC3809EMSE-1
• Description: IC CTRLR DC/DC SYNC 10-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3809EMSE-1

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 9.8 V
• Current - Output: 1A
• Frequency - Switching: 550kHz
• Voltage - Input: 2.75 ~ 9.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -

LTC3809-1
TYPICAL APPLICATIONS
PACKAGE DESCRIPTION
22
3.50 0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
2.15 0.05
OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS
OF VARIATION ASSIGNMENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
0.25 0.05
(2 SIDES)
220pF
Vx
L: VISHAY IHLP-2525CZ-01
C
V
OUT
OUT
100pF
1.18k
118k
15k
: SANYO 4TPB150MC
< Vx
2.38 0.05
(2 SIDES)
0.50
BSC
590Ω
Synchronous DC/DC Converter with Output Tracking
0.675 0.05
59k
6
4
2
3
1
PACKAGE
OUTLINE
MODE
IPRG
I
TRACK/SS
V
TH
FB
10-Lead Plastic DFN (3mm × 3mm)
LTC3809EDD-1
(Reference LTC DWG # 05-08-1698)
GND
(SEE NOTE 6)
TOP MARK
11
PIN 1
DD Package
0.200 REF
RUN
SW
V
BG
TG
IN
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON
ANY SIDE
TOP AND BOTTOM OF PACKAGE
9
8
10
7
5
MP
Si7540DP
MN
Si7540DP
0.75 0.05
3.00 0.10
(4 SIDES)
10μF
0.00 – 0.05
1.5μH
V
2.75V TO 8V
150μF
C
IN
L
OUT
1.65 0.10
(2 SIDES)
+
38091 TA03
BOTTOM VIEW—EXPOSED PAD
V
1.8V
(5A AT 5V
OUT
5
R = 0.115
6
2.38 0.10
(2 SIDES)
TYP
IN
)
10
1
0.50 BSC
0.25 0.05
0.38 0.10
(DD10) DFN 1103
38091fc