NB7L14MMNEVB ON Semiconductor, NB7L14MMNEVB Datasheet - Page 11

• Manufacturer Part Number: NB7L14MMNEVB
• Description: EVAL BOARD FOR NB7L14MMN
• Manufacturer: ON Semiconductor

Specifications of NB7L14MMNEVB

• Main Purpose: Timing, Clock Buffer / Driver / Receiver / Translator
• Embedded: No
• Utilized Ic / Part: NB7L14M
• Primary Attributes: Input Up To 12Gb/s & 8GHz
• Secondary Attributes: Differential CML Output
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NB7L14MMNEVBOS

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
2X
NOTE 4
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
LOCATION
16X
16X
0.05 C
0.05 C
PIN 1
0.10 C
K
L
0.10 C
DETAIL A
4
1
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
e/2
DETAIL B
e
BOTTOM VIEW
SIDE VIEW
16
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
8
(A3)
16X
9
0.10 C A B
A1
A
B
b
E
0.10 C
0.05 C
E2
A
C
NOTE 3
A B
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SEATING
PLANE
L1
http://onsemi.com
QFN16 3x3, 0.5P
CASE 485G−01
É É
É É É É
ALTERNATE TERMINAL
*For additional information on our Pb−Free strategy and soldering
ISSUE E
CONSTRUCTIONS
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
CONSTRUCTIONS
DETAIL A
11
DETAIL B
MOLD CMPD
ALTERNATE
L
PACKAGE
OUTLINE
16X
0.30
SOLDERING FOOTPRINT*
A1
1
É É
É É Ç Ç
RECOMMENDED
L
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
DIMENSIONS: MILLIMETERS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
0.50
PITCH
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
1.84 3.30
2X
16X
0.58
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
2X
NB7L14M/D