ECJ-2F60J226M Panasonic - ECG, ECJ-2F60J226M Datasheet - Page 15

• Manufacturer Part Number: ECJ-2F60J226M
• Description: CAP CERAMIC 22UF 6.3V 0805 X6S
• Manufacturer: Panasonic - ECG
• Series: ECJr

Specifications of ECJ-2F60J226M

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: ECJ2F60J226M; PCC2477TR

CLASSIFICATION
SUBJECT
3- 3.Selection of Soldering Flux
3- 4.Soldering
Note ;
3-4-1. Reflow soldering
Soldering flux may seriously affect the performance of the Capacitors. The following shall be confirmed before use.
(1) The soldering flux should have a halogen based content of 0.1 wt. % (converted to chlorine) or below.
(2) When applying water-soluble soldering flux, wash the Capacitors sufficiently because the soldering flux residue
Do not use soldering flux with strong acid.
on the surface of PC boards may deteriorate the insulation resistance on the Capacitor’s surface.
The reflow soldering temperature conditions are each temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling. Large temperature difference caused by rapid heat application to the Capacitors
may lead to excessive thermal stresses, contributing to the thermal cracks. The Preheating temperature
requires controlling with great care so that tombstone phenomenon may be prevented.
The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause
defects such as the thermal cracks, etc.
When the Capacitors are immersed into a cleaning solvent, confirm that the surface temperature of the devices
does not exceed 100℃.
Performing reflow soldering twice under the conditions shown in the figure above [Recommended profile of
Reflow soldering (EX)] will not cause any problems. However, pay attention to the possible warp and bending
of the PC board.
260
220
180
140
Recommended profile of Reflow soldering (Ex.)
Common Specification ( Precautions for Use)
①Preheating
②Temp. rise
③Heating
④Peak
⑤Gradual cooling
Multilayer Ceramic Chip Capacitor
①Preheating
60 to 120 s
②Temp. rise
SPECIFICATIONS
④Peak
③Heating
60 s max.
Preheating temp. to Peak temp.
Peak temp. to 140 ℃
⑤Gradual
140 to 180 ℃
260 ℃ max.
Temperature
220 ℃ min.
cooling
Time
〈 Allowable temperature difference ∆T〉
0508, 0612, 0504
0201 to 1206
1210
Size
Period or Speed
60 to 120 s
2 to 5 ℃/s
1 to 4 ℃/s
60 s max.
10 s max.
No.
PAGE
DATE
∆T≦ 150 °C
∆T≦ 130 °C
Temp. Tol.
151S-ECJ-SS018E
Apr. 1, 2008
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