PESD5V0L1BA,115 NXP Semiconductors, PESD5V0L1BA,115 Datasheet - Page 10

• Manufacturer Part Number: PESD5V0L1BA,115
• Description: DIODE LOW ESD PROTECTION SOD323
• Manufacturer: NXP Semiconductors

Specifications of PESD5V0L1BA,115

• Package / Case: SC-76, SOD-323, UMD2
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 7V
• Power (watts): 500W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Clamping Voltage: 10 V
• Operating Voltage: 5 V
• Breakdown Voltage: 7.6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 15 A
• Peak Pulse Power Dissipation: 500 W
• Capacitance: 75 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 1.8 mm L x 1.1 mm H
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 7V
• Reverse Stand-off Voltage: 5V
• Leakage Current (max): 1uA
• Peak Pulse Current: 15A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4049-2; 934058421115; PESD5V0L1BA T/R; PESD5V0L1BA T/R

NXP Semiconductors
7. Application information
PESDXL1BA_SER_2
Product data sheet
The PESDxL1BA series is designed for bidirectional protection of one signal line from the
damage caused by ElectroStatic Discharge (ESD) and surge pulses. The PESDxL1BA
series may be used on lines where the signal polarity is above and below ground. The
PESDxL1BA series provides a surge capability of up to 500 W per line for a 8/20 s
waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the protection device as close to the input terminal or connector as possible.
2. The path length between the protection device and the protected line should be
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductor.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
Fig 9.
minimized.
boards, use ground vias.
Typical application: Bidirectional protection of one signal line
Low capacitance bidirectional ESD protection diodes in SOD323
Rev. 02 — 20 August 2009
line to be protected
ground
PESDxL1BA
PESDxL1BA series
006aaa071
© NXP B.V. 2009. All rights reserved.
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