PIC16F616-I/P Microchip Technology, PIC16F616-I/P Datasheet - Page 166

• Manufacturer Part Number: PIC16F616-I/P
• Description: IC PIC MCU FLASH 2KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F616-I/P

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Number Of I /o: 11
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 12
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 14PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 11
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16F610/616/16HV610/616
17.2
The following sections give the technical details of the packages.
DS41288C-page 164
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
Package Details
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Preliminary
Units
L
A2
A1
E1
eB
E1
b1
N
A
D
e
E
L
c
b
A2
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–