PIC16F1937-I/P Microchip Technology, PIC16F1937-I/P Datasheet - Page 280

• Manufacturer Part Number: PIC16F1937-I/P
• Description: IC PIC MCU FLASH 512KX14 40-PDIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F1937-I/P

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 40-DIP (0.600", 15.24mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 36
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: EUSART/MI2C/SPI
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 14-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 14
• Height: 4.95 mm
• Length: 53.21 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Width: 14.73 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC16F193X/LF193X
23.6.13.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 23-36:
FIGURE 23-37:
DS41364D-page 280
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
Preliminary
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 23-35).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 23-36.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
T
Cleared by software
 2009 Microchip Technology Inc.
BRG
Interrupt cleared
by software
’0’
’0’
’0’