PIC16F1937-I/P Microchip Technology, PIC16F1937-I/P Datasheet - Page 392

• Manufacturer Part Number: PIC16F1937-I/P
• Description: IC PIC MCU FLASH 512KX14 40-PDIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F1937-I/P

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 40-DIP (0.600", 15.24mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 36
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: EUSART/MI2C/SPI
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 14-ch x 10-bit
• A/d Bit Size: 10 bit
• A/d Channels Available: 14
• Height: 4.95 mm
• Length: 53.21 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Width: 14.73 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC16F193X/LF193X
29.6
DS41364D-page 392
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature


JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
27.5
27.5
47.2
24.4
31.4
24.7
14.5
150
60
80
90
46
24
24
24
24
20
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2009 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))