PIC16F1937-I/P Microchip Technology, PIC16F1937-I/P Datasheet - Page 75
![IC PIC MCU FLASH 512KX14 40-PDIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F1937-I/P
Manufacturer Part Number
PIC16F1937-I/P
Description
IC PIC MCU FLASH 512KX14 40-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(508 pages)
3.PIC16LF1933-ISS.pdf
(46 pages)
4.PIC16F1936-ISS.pdf
(2 pages)
5.PIC16F1936-ISS.pdf
(10 pages)
6.PIC16F1936-ISS.pdf
(40 pages)
7.PIC16F1936-ISS.pdf
(30 pages)
8.PIC16F1936-ISS.pdf
(12 pages)
9.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16F1937-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
36
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
14
Height
4.95 mm
Length
53.21 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Width
14.73 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
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Manufacturer
Quantity
Price
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Part Number:
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Manufacturer:
CYPRESS
Quantity:
460
Company:
Part Number:
PIC16F1937-I/PT
Manufacturer:
Microchip Technology
Quantity:
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Manufacturer:
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Quantity:
20 000
- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1933-ISS PDF datasheet #3
- PIC16F1936-ISS PDF datasheet #4
- PIC16F1936-ISS PDF datasheet #5
- PIC16F1936-ISS PDF datasheet #6
- PIC16F1936-ISS PDF datasheet #7
- PIC16F1936-ISS PDF datasheet #8
- PIC16LF1934-IML PDF datasheet #9
- Current page: 75 of 508
- Download datasheet (5Mb)
5.2.2.6
The Internal Oscillator Block can be used with the 4X
PLL associated with the External Oscillator Block to
produce a 32 MHz internal system clock source. The
following settings are required to use the 32 MHz inter-
nal clock source:
• The FOSC bits in Configuration Word 1 must be
• The IRCF bits in the OSCCON register must be
• The SPLLEN bit in the OSCCON register must be
2009 Microchip Technology Inc.
set to use the INTOSC source as the device sys-
tem clock (FOSC<2:0> = 100).
set to the 8 MHz HFINTOSC selection
(IRCF<3:0> = 1110).
set to enable the 4X PLL.
Note:
The 4X PLL may also be enabled for use
with the Internal Oscillator Block by
programming
Configuration Word 2 to a ‘1’. However,
the 4X PLL cannot be disabled by
software and the 8 MHz HFINTOSC
option will no longer be available.
32 MHz Internal Oscillator
Frequency Selection
the
PLLEN
bit
Preliminary
in
5.2.2.7
When switching between the HFINTOSC, MFINTOSC
and the LFINTOSC, the new oscillator may already be
shut down to save power (see Figure 5-7). If this is the
case, there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC,
MFINTOSC and LFINTOSC oscillators. The sequence
of a frequency selection is as follows:
1.
2.
3.
4.
5.
6.
7.
See Figure 5-7 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 5-1.
Start-up delay specifications are located in the
oscillator
Specifications”.
PIC16F193X/LF193X
IRCF<3:0> bits of the OSCCON register are
modified.
If the new clock is shut down, a clock start-up
delay is started.
Clock switch circuitry waits for a falling edge of
the current clock.
The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
The new clock is now active.
The OSCSTAT register is updated as required.
Clock switch is complete.
tables
Internal Oscillator Clock Switch
Timing
of
Section 29.0
DS41364D-page 75
“Electrical
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