PIC18F1220-I/P Microchip Technology, PIC18F1220-I/P Datasheet - Page 14

• Manufacturer Part Number: PIC18F1220-I/P
• Description: IC MCU FLASH 2KX16 A/D 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F1220-I/P

• Program Memory Type: FLASH
• Program Memory Size: 4KB (2K x 16)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 7-ch x 10-bit
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F1230/1330
3.2
Programming code memory is accomplished by first
loading data into the write buffer and then initiating a
programming sequence. The write and erase buffer
sizes, shown in Table 3-4, can be mapped to any
location of the same size, beginning at 000000h. The
actual memory write sequence takes the contents of
this buffer and programs the proper amount of code
memory that contains the Table Pointer.
The programming duration is externally timed and is
controlled by PGC. After a Start Programming
command is issued (4-bit command, ‘1111’), a NOP is
issued, where the 4th PGC is held high for the duration
of the programming time, P9.
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time
specified by parameter P10 to allow high-voltage
discharge of the memory array.
TABLE 3-5:
DS39752B-page 14
Step 1: Direct access to code memory and enable writes.
Step 2: Load write buffer.
Step 3: Repeat for all but the last two bytes.
Step 4: Load write buffer for the last two bytes.
To continue writing data, repeat steps 2 through 4, where the Address Pointer is incremented by 2 at each iteration of the loop.
Command
0000
0000
0000
0000
0000
0000
0000
0000
1101
1111
0000
4-Bit
Code Memory Programming
8E A6
9C A6
0E <Addr[21:16]>
6E F8
0E <Addr[15:8]>
6E F7
0E <Addr[7:0]>
6E F6
<MSB><LSB>
<MSB><LSB>
00 00
WRITE CODE MEMORY CODE SEQUENCE
Data Payload
BSF
BCF
MOVLW <Addr[21:16]>
MOVWF TBLPTRU
MOVLW <Addr[15:8]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2.
Write 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
EECON1, EEPGD
EECON1, CFGS
The code sequence to program a PIC18F1230/1330
device is shown in Table 3-5. The flowchart, shown in
Figure 3-4, depicts the logic necessary to completely
write a PIC18F1230/1330 device. The timing diagram
that details the Start Programming command and
parameters P9 and P10 is shown in Figure 3-5.
TABLE 3-4:
PIC18F1230
PIC18F1330
Note:
Device
Core Instruction
The TBLPTR register must point to the
same region when initiating the program-
ming sequence as it did when the write
buffers were loaded.
WRITE AND ERASE BUFFER
SIZES
Write Buffer
Size (bytes)
© 2009 Microchip Technology Inc.
8
Erase Buffer
Size (bytes)
64