PIC16LF872-I/SP Microchip Technology, PIC16LF872-I/SP Datasheet - Page 156

• Manufacturer Part Number: PIC16LF872-I/SP
• Description: IC MCU FLASH 2KX14 EE A/D 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF872-I/SP

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16LF
• No. Of I/o's: 22
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No.: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16F872
28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
DS30221C-page 154
Note:
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Drawing No. C04-073
B
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
n
E1
E
Dimension Limits
Units
A2
E1
A1
D
n
p
A
E
L
c
B
2
1
L
D
MIN
.065
.002
.295
.390
.022
.004
.197
.009
0°
-
A1
INCHES
NOM
A
28
.026
.307
.402
.030
.069
.209
4°
-
-
-
-
MAX
.073
.323
.220
.413
.037
.010
.015
.079
8°
-
MIN
1.65
0.05
5.00
9.90
0.55
0.22
7.49
0.09
0°
-
MILLIMETERS*
© 2006 Microchip Technology Inc.
NOM
28
10.20
0.65
1.75
7.80
5.30
0.75
4°
-
-
-
-
Revised 1-12-06
A2
MAX
10.50
8.20
5.60
0.95
0.25
0.38
1.85
2.00
8°
-