PIC24FJ64GA104-I/PT Microchip Technology, PIC24FJ64GA104-I/PT Datasheet - Page 19

• Manufacturer Part Number: PIC24FJ64GA104-I/PT
• Description: IC PIC MCU FLASH 64KB 44-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GA104-I/PT

• Core Size: 16-Bit
• Program Memory Size: 64KB (22K x 24)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Interface: I2C, LIN, SPI, USART
• No. Of Pwm Channels: 5
• Embedded Interface Type: I2C, LIN, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, IrDA, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

 2010 Microchip Technology Inc.
When the capacitive sense pads are active, the device wakes up more often (once per
second). In addition, data is only stored to the EEPROM when a capacitive touch event
is detected. The same is true when all sensors are active.
Pressing and holding S3 for more than two seconds selects between Sleep, Deep
Sleep and Idle modes for the PIC24F microcontroller. In Deep Sleep, most micro-
controller functions are disabled to minimize power consumption. The available
wake-up sources supported by the XLP 16-Bit Development Board are RTCC interrupt,
External Interrupt 0 (INT0) and MCLR Reset. When Idle mode is selected, all
peripherals continue to operate; however, program memory is disabled and code
execution is stopped to reduce power consumption.
Because of the limited number of wake-up sources available in Deep Sleep mode, S3
can not wake the microcontroller. However, S1 (MCLR Reset) and S2 (connected to
INT0) can wake up the device. The RTCC interrupt will continue to periodically wake-up
the microcontroller every 10 seconds. The display indicates which wake-up source is
used to exit Deep Sleep mode.
Holding S2 while resetting the device resets the datalog, restarting the EEPROM
address counter at 00h.
Holding S3 while resetting the device outputs the EEPROM contents via the UART. The
output consists of a data log of time-stamps from the RTCC and the sensor
measurements taken at that time.
2.2.1
The demonstration software has a number of configuration options to allow it to be used
in a number of low-power applications. These are implemented in the application
source code using #ifdef statements.
There are two projects which share configuration options:
• The XLP16Demo project, which implements the full functionality of the board for a
• The XLPEHDemo project, customized for use with an Energy Harvester as a
Eight configuration options are available:
• USE_PWRCTL enables the control of power to external circuits dynamically via an
• USE_PWRCTL_ONESHOT is an alternative to USE_PWRCTL. This option enables
• USE_BUTTON_HOLD enables the firmware to detect when a user presses and
typical low-power application powered by a battery.
power supply.
I/O pin driving the gate of a FET. This allows the code to disable power consuming
external devices when they are not in use, such as when the device is asleep.
With this define, the firmware dynamically enables and disables external devices
as they are used.
and disables external devices only once per loop. External devices are powered
on when the microcontroller wakes from Sleep and powered off after completing
the loop, but before entering Sleep. This option is provided for low-power applica-
tions which have restrictions on the peak current available, as dynamic power
control of the external devices can cause undesired current spikes.
holds S2 or S3 for a specific amount of time. The held-button detection algorithm
is implemented to consume as little power as possible. However, due to the length
of time required to detect a button press and release, it may consume too much
power for some applications. These applications can disable held-button
detection to maintain minimal power consumption.
Note:
Demo Program Configuration
While the capacitive touch pads are enabled, the demo application will
enter Sleep mode instead of Deep Sleep; this permits the touch pads to
remain active and exit the Low-Power mode.
DS51873B-page 19