PIC24FJ64GA104-I/PT Microchip Technology, PIC24FJ64GA104-I/PT Datasheet - Page 25

IC PIC MCU FLASH 64KB 44-TQFP

PIC24FJ64GA104-I/PT

Manufacturer Part Number
PIC24FJ64GA104-I/PT
Description
IC PIC MCU FLASH 64KB 44-TQFP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr

Specifications of PIC24FJ64GA104-I/PT

Core Size
16-Bit
Program Memory Size
64KB (22K x 24)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Controller Family/series
PIC24
Ram Memory Size
8KB
Cpu Speed
32MHz
No. Of Timers
5
Interface
I2C, LIN, SPI, USART
No. Of Pwm Channels
5
Embedded Interface Type
I2C, LIN, SPI, USART
Rohs Compliant
Yes
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, IrDA, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
35
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24FJ64GA104-I/PT
Manufacturer:
AD
Quantity:
1 296
Part Number:
PIC24FJ64GA104-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC24FJ64GA104-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
 2010 Microchip Technology Inc.
3.2.7
Two push button switches (S2 and S3) are provided for user-defined digital inputs.
They are connected to the I/O pins shown in Table 3-5. When pressed, they pull the
respective port pin to ground. Using these switches requires the corresponding pin’s
internal weak pull-ups be enabled. When the switches are not required, the pull-ups
can be disabled; this adds the ability to reduce power consumption in software.
TABLE 3-5:
3.2.8
A 100 k potentiometer (R9) is connected to AN12 for all PIC24F devices. It can be
adjusted from V
On PIC24F K-series Flash devices, the potentiometer also provides a reference volt-
age for the High-Low Voltage Detect (HLVD) module. HLVD is not implemented on
J-series Flash devices.
3.2.9
The board features one yellow and one red LED (D2 and D3) that can serve as
user-defined outputs. D2 is connected to the RB8 port pin for all PIC24F devices. D3
is connected to RB15 on K-series Flash devices only. Ensure the correct device family
is selected on switch, S4.
3.2.10
A 24AA256 256 KB (32 Kbytes x 8) serial EEPROM (U6) is connected to I2C1 for both
PIC24F 20-pin and 28-pin devices. It is used to demonstrate I
included for nonvolatile firmware storage, in addition to the internal data EEPROM of
the PIC24F16KA102. The SDA and SCl signals for the I
at test points near U6 and at take-off points adjacent to the prototype area.
3.2.11
The XLP 16-bit board features two different temperature sensing options. An MCP9700
analog output thermistor (U4) is connected to a PIC
The thermistor’s output voltage has a linear correlation to the temperature.
The thermistor is disconnected from the microcontroller by removing jumper, JP5. To
use I/O pins efficiently, the thermistor is multiplexed with Capacitive Touch Pad 3. Avoid
contact with this pad during temperature measurements to minimize effect on
temperature measurement accuracy.
The XLP 16-bit board also implements a conventional junction diode connected to an
analog input to demonstrate low-cost temperature sensing. The Charge Time
Measurement Unit (CTMU) provides a specified current to the diode; an A/D conver-
sion determines the voltage across the diode. This voltage has a linear correlation to
the diode’s temperature. For more information on this solution, refer to TB3016, “Using
the PIC
The XLP 16-bit demonstration software implements both the MCP9700 and diode CTMU
measurement solutions via a compile-time option. By default, the MCP9700 is used. Note
that when switching to the diode temperature measurement, it may be necessary to cali-
brate the measurement by changing the diode calibration constants to account for
part-to-part variation in the diode.
Switch
S2
S3
®
MCU CTMU for Temperature Measurement” (DS93016) for more information.
User-Defined Switches
Potentiometer
User-Defined LEDs
Serial EEPROM
Temperature Measurement Options
RB14/CN12
RB7/INT0
DD
PUSH BUTTON SWITCH INPUT ASSIGNMENTS
28-Pin
to V
Input Ports
SS
to provide an analog input voltage to the A/D Converter.
RA6/CN8
20-Pin
N/C
Internal weak pull-ups required
®
MCU A/D Converter input (AN1).
2
C bus are available to the user
2
C™ bus operation. It is
Note
DS51873B-page 25

Related parts for PIC24FJ64GA104-I/PT