DSPIC30F3014-30I/P Microchip Technology, DSPIC30F3014-30I/P Datasheet - Page 196

• Manufacturer Part Number: DSPIC30F3014-30I/P
• Description: IC DSPIC MCU/DSP 24K 40DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3014-30I/P

• Program Memory Type: FLASH
• Package / Case: 40-DIP (0.600", 15.24mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 30
• Program Memory Size: 24KB (8K x 24)
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Operating Supply Voltage: 2.5 V to 5.5 V
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 1024 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F003 - MODULE SOCKET DSPIC30F 40DIPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0206 - ADAPTER MPLABICE 40P 600 MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301430/P

dsPIC30F3014/4013
TABLE 23-30: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
FIGURE 23-15:
DS70138G-page 196
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP40
SP41
Note 1:
Param
No.
Note: Refer to
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SCK
2:
3:
4:
X
X
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
Figure 23-3
SP36
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
SP40
X
X
X
X
X
MSb In
X
X
X
Output Low Time
Output High Time
Output Fall Time
Output Rise Time
Edge
MSb
Data Output Rise Time
Data Output Fall Time
Data Output Valid after
Characteristic
X
X
SP11
SP41
for load conditions.
Edge
Edge
SP30,SP31
SP35
X
SP10
X
Data Input
Data Input
(1)
(4
(3)
Bit 14 - - - - - -1
(4)
(3)
Bit 14 - - - -1
(4)
(4)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
T
T
Min
CY
CY
—
—
—
—
—
20
20
/2
/2
SP21
SP20
Typ
LSb In
LSb
—
—
—
—
—
—
—
—
—
(2)
SP20
SP21
Max
30
—
—
—
—
—
—
—
—
-40°C  T
-40°C  T
 2010 Microchip Technology Inc.
Units
A
A
ns
ns
ns
ns
ns
ns
ns
ns
ns
 +85°C for Industrial
 +125°C for Extended
See parameter
DO32
See parameter
DO31
See parameter
DO32
See parameter
DO31
Conditions