PIC18F2525-I/SO Microchip Technology, PIC18F2525-I/SO Datasheet - Page 362

IC MCU FLASH 24KX16 28SOIC

PIC18F2525-I/SO

Manufacturer Part Number
PIC18F2525-I/SO
Description
IC MCU FLASH 24KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2525-I/SO

Program Memory Type
FLASH
Program Memory Size
48KB (24K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18F4620 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2525-I/SO
Manufacturer:
HITTITE
Quantity:
101
PIC18F2525/2620/4525/4620
FIGURE 26-23:
TABLE 26-25: A/D CONVERSION REQUIREMENTS
DS39626E-page 360
130
131
132
135
TBD
Note 1:
Param
No.
A/D CLK
Note 1:
2:
3:
4:
A/D DATA
SAMPLE
T
T
T
T
T
ADRES
Symbol
AD
CNV
ACQ
SWC
BSF ADCON0, GO
DIS
ADIF
The time of the A/D clock period is dependent on the device frequency and the T
ADRES register may be read on the following T
The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale
after the conversion (V
On the following cycle of the device clock.
GO
2:
Q4
(1)
If the A/D clock source is selected as RC, a time of T
This allows the SLEEP instruction to be executed.
This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
A/D Clock Period
Conversion Time
(not including acquisition time) (Note 2)
Acquisition Time (Note 3)
Switching Time from Convert → Sample
Discharge Time
132
A/D CONVERSION TIMING
(Note 2)
Characteristic
DD
9
to V
SS
PIC18FXXXX
PIC18LFXXXX
PIC18FXXXX
PIC18LFXXXX
8
or V
OLD_DATA
SS
7
to V
. . .
SAMPLING STOPPED
DD
CY
). The source impedance (R
CY
is added before the A/D clock starts.
cycle.
. . .
131
130
Min
0.7
1.4
1.4
0.2
11
2
(Note 4)
25.0
25.0
Max
12
1
3
(1)
(1)
1
Units
T
μs
μs
μs
μs
μs
μs
AD
S
© 2008 Microchip Technology Inc.
) on the input channels is 50Ω.
0
T
V
T
A/D RC mode
V
-40°C to +85°C
OSC
OSC
DD
DD
AD
= 2.0V;
= 2.0V; A/D RC mode
based, V
based, V
clock divider.
NEW_DATA
DONE
Conditions
T
CY
REF
REF
≥ 3.0V
full range

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