PIC16F877-04/P Microchip Technology, PIC16F877-04/P Datasheet - Page 510

IC MCU FLASH 8KX14 EE 40DIP

PIC16F877-04/P

Manufacturer Part Number
PIC16F877-04/P
Description
IC MCU FLASH 8KX14 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F877-04/P

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 8 Channel
Package
40PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F877-04/P
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PICmicro MID-RANGE MCU FAMILY
28.1
DS31028A-page 28-2
Introduction
All midrange devices can be In-Circuit Serial Programmed (ICSP™) while in the end application
circuit. This is simply done with two lines for clock and data, and three other lines for power,
ground, and the programming voltage.
In-Circuit Serial Programming (ICSP™) is a great way to reduce your inventory overhead and
time-to-market for your product. By assembling your product with a blank Microchip microcontrol-
ler (MCU), you can stock one design. When an order has been placed, these units can be pro-
grammed with the latest revision of firmware, tested, and shipped in a very short time. This
method also reduces scrapped inventory due to old firmware revisions. This type of manufactur-
ing system can also facilitate quick turnarounds on custom orders for your product.
Most people would think to use ICSP with PICmicro™ OTP MCUs only on an assembly line
where the device is programmed once. However, there is a method by which an OTP device can
be programmed several times depending on the size of the firmware. This method, explained
later, provides a way to field upgrade your firmware in a way similar to EEPROM- or Flash-based
devices.
1997 Microchip Technology Inc.

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