PIC16F877-04/P Microchip Technology, PIC16F877-04/P Datasheet - Page 614

IC MCU FLASH 8KX14 EE 40DIP

PIC16F877-04/P

Manufacturer Part Number
PIC16F877-04/P
Description
IC MCU FLASH 8KX14 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F877-04/P

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 8 Channel
Package
40PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PICmicro MID-RANGE MCU FAMILY
31.1
31.2
31.3
DS31031A-page 31-2
Introduction
Characterization vs. Electrical Specification
DC and AC Characteristics Graphs and Tables
Microchip Technology Inc. provides characterization information on the devices that it manufac-
tures. This information becomes available after the devices have undergone a complete charac-
terization and the data has been analyzed. This data is taken on both device testers and on
bench setups. The characterization data gives the designer a better understanding of the device
characteristics, to better judge the acceptability of the device to the application.
The difference between this information and the Electrical specifications can be classified as
what the user should expect the devices to do vs. what Microchip tests the devices to. The char-
acterization graphs and tables provided are for design guidance and are not tested or guaran-
teed.
There may be differences between what the characterization shows as the limits vs. that which
is tested, as shown in the Electrical Specification section. This results from capabilities of the pro-
duction tester equipment, plus whatever guard band that may be necessary.
Each table gives specific information that may be useful design information. These values are
taken under fixed circumstances. Measurements taken in your application may not lead to the
same values if your circumstances are not the same.
In some graphs or tables the data presented are outside specified operating range (i.e., outside
specified V
specified range.
Note:
DD
The data presented in the device Data Sheet Characterization section is a statistical
summary of data collected on units from different lots over a period of time and
matrix samples. 'Typical' represents the mean of the distribution at, 25 C, while
'max' or 'min' represents (mean +3 ) and (mean -3 ) respectively where
dard deviation.
range). This is for information only and devices will operate properly only within the
1997 Microchip Technology Inc.
is stan-

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