MC56F8322MFAE Freescale Semiconductor, MC56F8322MFAE Datasheet - Page 124
![IC DSP 16BIT 60MHZ 48-LQFP](/photos/12/20/122006/mc56f8322mfae_sml.jpg)
MC56F8322MFAE
Manufacturer Part Number
MC56F8322MFAE
Description
IC DSP 16BIT 60MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet
1.MC56F8122VFAE.pdf
(136 pages)
Specifications of MC56F8322MFAE
Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
21
Program Memory Size
40KB (20K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 6x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Cpu Family
56F8xxx
Device Core Size
16b
Frequency (max)
60MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
21
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.75/3.6V
Operating Supply Voltage (min)
2.25/3V
On-chip Adc
2(3-chx12-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Operating Supply Voltage
- 0.3 V to + 4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Rom Size
8 KB
Minimum Operating Temperature
- 40 C
For Use With
MC56F8323EVME - BOARD EVALUATION MC56F8323
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC56F8322MFAE
Manufacturer:
VISHAY
Quantity:
12 500
Company:
Part Number:
MC56F8322MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8322MFAE
Manufacturer:
FREESCALE
Quantity:
20 000
10.16 Equivalent Circuit for ADC Inputs
Figure 10-21
at the same time that S3 is closed/open. When S1/S2 closed & S3 open, one input of the sample and hold
circuit moves to (V
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about (V
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, V
10.17 Power Consumption
See
which can be used to optimize power consumption for a given application.
Power consumption is given by the following equation:
A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage currents,
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
124
Total power =
1.
2.
3.
4.
Section 10.1
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
REF
illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
Analog Input
and the ADC clock frequency.
+D: external [dynamic component]
for a list of IDD requirements for the device. This section provides additional detail
+B: internal [state-dependent component]
+C: internal [dynamic component]
+E: external [static]
A: internal [static component]
REFH
1
Figure 10-21 Equivalent Circuit for A/D Loading
-V
REFLO
2
)/2, while the other charges to the analog input voltage. When the
56F8322 Techncial Data, Rev. 16
(V
REFH
3
- V
REFLO )
/ 2
S1
S2
4
S3
REFH
C1
C2
S/H
-V
REFLO
C1 = C2 = 1pF
)/2. The switches switch
Freescale Semiconductor
Preliminary