MC56F8322MFAE Freescale Semiconductor, MC56F8322MFAE Datasheet - Page 130

• Manufacturer Part Number: MC56F8322MFAE
• Description: IC DSP 16BIT 60MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8322MFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 21
• Program Memory Size: 40KB (20K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 21
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.75/3.6V
• Operating Supply Voltage (min): 2.25/3V
• On-chip Adc: 2(3-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 4 KB
• Operating Supply Voltage: - 0.3 V to + 4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Rom Size: 8 KB
• Minimum Operating Temperature: - 40 C
• For Use With: MC56F8323EVME - BOARD EVALUATION MC56F8323
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Please see www.freescale.com for the most current case outline.
130
B
B1
9
AB
AC
T
12
1
4X
SECTION AE-AE
0.080
4X
0.200 AC T-U
48
13
S1
0.200 AB T-U
BASE METAL
M
A1
F
D
AC
G
A
S
Figure 11-3 48-Pin LQFP Mechanical Information
T-U
N
Z
Z
AD
Z
Z
J
37
24
36
25
U
56F8322 Techncial Data, Rev. 16
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
M °
DETAIL Y
W
AE
P
T, U, Z
AA
AE
K
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
R
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT DATUM
PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE
AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.350.
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
L °
DIM
AA
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
R
S
V
F
J
L
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
0
Freescale Semiconductor
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
°
°
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
7
°
Preliminary