LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 30
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LPC1113FHN33/301,5
Manufacturer Part Number
LPC1113FHN33/301,5
Description
IC MCU 32BIT 24KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC1100r
Datasheets
1.LPC1114FHN333015.pdf
(2 pages)
2.LPC1114FHN333015.pdf
(66 pages)
3.LPC1114FHN333015.pdf
(66 pages)
4.LPC1113FHN333015.pdf
(60 pages)
Specifications of LPC1113FHN33/301,5
Program Memory Type
FLASH
Program Memory Size
24KB (24K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
LPC1100
Device Core
ARM Cortex M0
Device Core Size
32b
Frequency (max)
50MHz
Total Internal Ram Size
8KB
# I/os (max)
42
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
33
Package Type
HVQFN EP
Package
33HVQFN EP
Family Name
LPC1100
Maximum Speed
50 MHz
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4951
935290776551
935290776551
NXP Semiconductors
9. Static characteristics
Table 7.
T
LPC1111_12_13_14
Product data sheet
Symbol
V
I
Standard port pins, RESET
I
I
I
V
V
V
V
V
V
V
DD
IL
IH
OZ
amb
DD
I
O
IH
IL
hys
OH
OL
= −40 °C to +85 °C, unless otherwise specified.
Static characteristics
Parameter
supply voltage (core
and external rail)
supply current
LOW-level input current V
HIGH-level input
current
OFF-state output
current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
All information provided in this document is subject to legal disclaimers.
Conditions
Active mode; code
executed from flash
Sleep mode;
Deep-sleep mode;
V
Deep power-down mode;
V
resistor disabled
V
pull-down resistor
disabled
V
on-chip pull-up/down
resistors disabled
pin configured to provide
a digital function
output active
2.0 V ≤ V
I
1.8 V ≤ V
I
2.0 V ≤ V
I
1.8 V ≤ V
I
OH
OH
OL
OL
DD
DD
I
I
O
system clock = 12 MHz
system clock = 50 MHz
system clock = 12 MHz
= 0 V; on-chip pull-up
= V
= 0 V; V
= 4 mA
= 3 mA
= −4 mA
= −3 mA
while(1){}
V
V
V
= 3.3 V
= 3.3 V
DD
DD
DD
DD
Rev. 2 — 18 August 2010
; on-chip
= 3.3 V
= 3.3 V
= 3.3 V
DD
DD
DD
DD
O
≤ 3.6 V;
< 2.0 V;
≤ 3.6 V;
< 2.0 V;
= V
DD
;
[2][3][4]
[2][3][5]
[2][3][4]
[2][3][8]
[10][11]
[5][6]
[6][7]
[5][6]
[2][9]
[12]
32-bit ARM Cortex-M0 microcontroller
Min
1.8
-
-
-
-
-
-
-
-
0
0
0.7V
-
-
V
V
-
-
DD
DD
LPC1111/12/13/14
− 0.4
− 0.4
DD
Typ
3.3
3
9
2
6
220
0.5
0.5
0.5
-
-
-
-
0.4
-
-
-
-
[1]
© NXP B.V. 2010. All rights reserved.
Max
3.6
-
-
-
-
-
10
10
10
5.0
V
-
0.3V
-
-
-
0.4
0.4
DD
DD
30 of 60
Unit
V
mA
mA
mA
μA
nA
nA
nA
nA
V
V
V
V
V
V
V
V
V