LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 45
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LPC1113FHN33/301,5
Manufacturer Part Number
LPC1113FHN33/301,5
Description
IC MCU 32BIT 24KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC1100r
Datasheets
1.LPC1114FHN333015.pdf
(2 pages)
2.LPC1114FHN333015.pdf
(66 pages)
3.LPC1114FHN333015.pdf
(66 pages)
4.LPC1113FHN333015.pdf
(60 pages)
Specifications of LPC1113FHN33/301,5
Program Memory Type
FLASH
Program Memory Size
24KB (24K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
LPC1100
Device Core
ARM Cortex M0
Device Core Size
32b
Frequency (max)
50MHz
Total Internal Ram Size
8KB
# I/os (max)
42
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
33
Package Type
HVQFN EP
Package
33HVQFN EP
Family Name
LPC1100
Maximum Speed
50 MHz
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4951
935290776551
935290776551
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
10.4 I/O pins
10.5 I
Table 15.
T
[1]
Table 16.
T
[1]
[2]
[3]
[4]
[5]
Symbol
t
t
Symbol
f
t
t
t
t
t
2
r
f
SCL
f
LOW
HIGH
HD;DAT
SU;DAT
amb
amb
C-bus
Applies to standard port pins and RESET pin.
See the I
Parameters are valid over operating temperature range unless otherwise specified.
t
and the acknowledge.
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the
V
C
HD;DAT
= −40 °C to +85 °C; 3.0 V ≤ V
= −40 °C to +85 °C.
IH
b
= total capacitance of one bus line in pF.
(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
is the data hold time that is measured from the falling edge of SCL; applies to data in transmission
Dynamic characteristic: I/O pins
Dynamic characteristic: I
2
C-bus specification UM10204 for details.
Parameter
SCL clock
frequency
fall time
LOW period of
the SCL clock
HIGH period of
the SCL clock
data hold time
data set-up
time
All information provided in this document is subject to legal disclaimers.
Parameter
rise time
fall time
[2]
Rev. 2 — 18 August 2010
[4][5][6][7]
[3][4][8]
[9][10]
DD
Conditions
pin
configured as
output
pin
configured as
output
≤ 3.6 V.
2
C-bus pins
Conditions
Standard-mode
Fast-mode
Fast-mode Plus
of both SDA and
SCL signals
Standard-mode
Fast-mode
Fast-mode Plus
Standard-mode
Fast-mode
Fast-mode Plus
Standard-mode
Fast-mode
Fast-mode Plus
Standard-mode
Fast-mode
Fast-mode Plus
Standard-mode
Fast-mode
Fast-mode Plus
[1]
[1]
32-bit ARM Cortex-M0 microcontroller
Min
3.0
2.5
LPC1111/12/13/14
Min
0
0
0
-
20 + 0.1 × C
-
4.7
1.3
0.5
4.0
0.6
0.26
0
0
0
250
100
50
Typ
-
-
b
© NXP B.V. 2010. All rights reserved.
Max
100
400
1
300
300
120
-
-
-
-
-
-
-
-
-
-
-
-
Max
5.0
5.0
Unit
kHz
kHz
MHz
ns
ns
ns
μs
μs
μs
μs
μs
μs
μs
μs
μs
ns
ns
ns
Unit
ns
ns
45 of 60