ST72F32AK2T6 STMicroelectronics, ST72F32AK2T6 Datasheet - Page 144

• Manufacturer Part Number: ST72F32AK2T6
• Description: MCU 8BIT 8KB FLASH/ROM 32-TQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F32AK2T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TQFP, 32-VQFP
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 1.4 mm
• Length: 7 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3.8 V
• Width: 7 mm
• For Use With: 497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5610

ST7232A
13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages will be converted
in 2005 to lead-free technology, named ECO-
PACK
PCN CRP/04/744 "Lead-free Conversion Program
- Compliance with RoHS", issued November 18th,
2004).
■
■
Table 26. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
144/157
1
SDIP & PDIP
TQFP and SO
ECOPACK
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronic
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
(for a detailed roadmap, please refer to
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
TM
TQFP, SDIP and SO packages
Pb-free solder paste
Yes *
Yes *