M30625FGPGP#U7C Renesas Electronics America, M30625FGPGP#U7C Datasheet - Page 336
![IC M16C MCU FLASH 256K 128LQFP](/photos/12/29/122954/m30625fgpgp_u7c_sml.jpg)
M30625FGPGP#U7C
Manufacturer Part Number
M30625FGPGP#U7C
Description
IC M16C MCU FLASH 256K 128LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/60r
Datasheets
1.QSK-62P_PLUS.pdf
(103 pages)
2.M30622SAFPU5.pdf
(308 pages)
3.M30620SPGPU3C.pdf
(423 pages)
Specifications of M30625FGPGP#U7C
Core Processor
M16C/60
Core Size
16-Bit
Speed
24MHz
Connectivity
I²C, IEBus, UART/USART
Peripherals
DMA, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
For Use With
867-1000 - KIT QUICK START RENESAS 62PR0K33062PS001BE - R0K33062P STARTER KITR0K33062PS000BE - KIT EVAL STARTER FOR M16C/62PM3062PT3-CPE-3 - EMULATOR COMPACT M16C/62P/30P
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
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M16C/62P Group (M16C/62P, M16C/62PT)
Rev.2.41
REJ09B0185-0241
Switching Characteristics
(V
CC1
Table 23.29
NOTES:
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
d(BCLK-AD)
h(BCLK-AD)
h(RD-AD)
h(WR-AD)
d(BCLK-CS)
h(BCLK-CS)
h(RD-CS)
h(WR-CS)
d(BCLK-RD)
h(BCLK-RD)
d(BCLK-WR)
h(BCLK-WR)
d(BCLK-DB)
h(BCLK-DB)
d(DB-WR)
h(WR-DB)
d(BCLK-HLDA)
d(BCLK-ALE)
h(BCLK-ALE)
d(AD-ALE)
h(AD-ALE)
d(AD-RD)
d(AD-WR)
dz(RD-AD)
Symbol
1. Calculated according to the BCLK frequency as follows:
2. Calculated according to the BCLK frequency as follows:
3. Calculated according to the BCLK frequency as follows:
4. Calculated according to the BCLK frequency as follows:
= V
CC2
Jan 10, 2006
----------------------- - 10 ns
f BCLK
(
----------------------------------- - 40 ns
----------------------- - 25 ns
f BCLK
----------------------- - 15 ns
f BCLK
0.5x10
0.5x10
0.5x10
(
(
(
n 0.5
f BCLK
–
= 5V, V
(
Address Output Delay Time
Address Output Hold Time (in relation to BCLK)
Address Output Hold Time (in relation to RD)
Address Output Hold Time (in relation to WR)
Chip Select Output Delay Time
Chip Select Output Hold Time (in relation to BCLK)
Chip Select Output Hold Time (in relation to RD)
Chip Select Output Hold Time (in relation to WR)
RD Signal Output Delay Time
RD Signal Output Hold Time
WR Signal Output Delay Time
WR Signal Output Hold Time
Data Output Delay Time (in relation to BCLK)
Data Output Hold Time (in relation to BCLK)
Data Output Delay Time (in relation to WR)
Data Output Hold Time (in relation to WR)
HLDA Output Delay Time
ALE Signal Output Delay Time (in relation to BCLK)
ALE Signal Output Hold Time (in relation to BCLK)
ALE Signal Output Delay Time (in relation to Address)
ALE Signal Output Hold Time (in relation to Address)
RD Signal Output Delay From the End of Address
WR Signal Output Delay From the End of Address
Address Output Floating Start Time
9
9
9
access and multiplex bus selection)
Memory Expansion and Microprocessor Modes (for 2- to 3-wait setting, external area
)x10
)
)
)
–
–
–
)
SS
9
[
[
[
–
= 0V, at T
]
]
]
[
Page 319 of 390
]
n is “2” for 2-wait setting, “3” for 3-wait setting.
opr
Parameter
= −20 to 85°C / −40 to 85°C unless otherwise specified)
See
Figure 23.2
(NOTE 1)
(NOTE 1)
(NOTE 1)
(NOTE 1)
(NOTE 2)
(NOTE 1)
(NOTE 3)
(NOTE 4)
V
23. Electrical Characteristics
Min.
CC1
−4
4
4
0
0
4
0
0
Standard
=V
Max.
25
25
25
25
40
40
15
8
CC2
=5V
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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