PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 510

• Manufacturer Part Number: PIC16F818-I/P
• Description: IC MCU FLASH 1KX14 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F818-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PICmicro MID-RANGE MCU FAMILY
28.1
DS31028A-page 28-2
Introduction
All midrange devices can be In-Circuit Serial Programmed (ICSP™) while in the end application
circuit. This is simply done with two lines for clock and data, and three other lines for power,
ground, and the programming voltage.
In-Circuit Serial Programming (ICSP™) is a great way to reduce your inventory overhead and
time-to-market for your product. By assembling your product with a blank Microchip microcontrol-
ler (MCU), you can stock one design. When an order has been placed, these units can be pro-
grammed with the latest revision of firmware, tested, and shipped in a very short time. This
method also reduces scrapped inventory due to old firmware revisions. This type of manufactur-
ing system can also facilitate quick turnarounds on custom orders for your product.
Most people would think to use ICSP with PICmicro™ OTP MCUs only on an assembly line
where the device is programmed once. However, there is a method by which an OTP device can
be programmed several times depending on the size of the firmware. This method, explained
later, provides a way to field upgrade your firmware in a way similar to EEPROM- or Flash-based
devices.
1997 Microchip Technology Inc.