PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 614

• Manufacturer Part Number: PIC16F818-I/P
• Description: IC MCU FLASH 1KX14 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F818-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PICmicro MID-RANGE MCU FAMILY
31.1
31.2
31.3
DS31031A-page 31-2
Introduction
Characterization vs. Electrical Specification
DC and AC Characteristics Graphs and Tables
Microchip Technology Inc. provides characterization information on the devices that it manufac-
tures. This information becomes available after the devices have undergone a complete charac-
terization and the data has been analyzed. This data is taken on both device testers and on
bench setups. The characterization data gives the designer a better understanding of the device
characteristics, to better judge the acceptability of the device to the application.
The difference between this information and the Electrical specifications can be classified as
what the user should expect the devices to do vs. what Microchip tests the devices to. The char-
acterization graphs and tables provided are for design guidance and are not tested or guaran-
teed.
There may be differences between what the characterization shows as the limits vs. that which
is tested, as shown in the Electrical Specification section. This results from capabilities of the pro-
duction tester equipment, plus whatever guard band that may be necessary.
Each table gives specific information that may be useful design information. These values are
taken under fixed circumstances. Measurements taken in your application may not lead to the
same values if your circumstances are not the same.
In some graphs or tables the data presented are outside specified operating range (i.e., outside
specified V
specified range.
Note:
DD
The data presented in the device Data Sheet Characterization section is a statistical
summary of data collected on units from different lots over a period of time and
matrix samples. 'Typical' represents the mean of the distribution at, 25 C, while
'max' or 'min' represents (mean +3 ) and (mean -3 ) respectively where
dard deviation.
range). This is for information only and devices will operate properly only within the
1997 Microchip Technology Inc.
is stan-