PIC18F25K22-I/SP Microchip Technology, PIC18F25K22-I/SP Datasheet - Page 491

• Manufacturer Part Number: PIC18F25K22-I/SP
• Description: MCU 8BIT 32KB FLASH 5.5V 28SDIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F25K22-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: I2C, SPI, EUSART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 7
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 17 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Packaging
Option:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Packaging
Option
PIC18F46K22, PIC18LF46K22
PIC18F45K22, PIC18LF45K22
PIC18F44K22, PIC18LF44K22
PIC18F43K22, PIC18LF43K22
PIC18F26K22, PIC18LF26K22
PIC18F25K22, PIC18LF25K22
PIC18F24K22, PIC18LF24K22
PIC18F23K22, PIC18LF23K22
blank = standard packaging (tube or tray)
T = Tape and Reel
E
I
ML
MV
P
PT
SO
SP
SS
QTP, SQTP, Code or Special Requirements
(blank otherwise)
X
=
=
=
=
=
=
=
= -40C to +125C
= -40C to +85C
QFN
UQFN
PDIP
TQFP (Thin Quad Flatpack)
SOIC
Skinny Plastic DIP
SSOP
-
Temperature
(1)
Range
X
(Extended)
(Industrial)
Package
/XX
Preliminary
Pattern
XXX
PIC18(L)F2X/4XK22
Examples:
a)
b)
c)
d)
Note 1:
PIC18F46K22-E/P 301 = Extended temp.,
PDIP package, QTP pattern #301.
PIC18F46K22-I/SO = Industrial temp., SOIC
package.
PIC18F46K22-E/P = Extended temp., PDIP
package.
PIC18F46K22T-I/ML
Industrial temp., QFN package.
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
.
=
Tape
DS41412B-page 491
and
reel,