PIC18LF45K22-I/ML Microchip Technology, PIC18LF45K22-I/ML Datasheet - Page 251

MCU 8BIT 32KB FLASH 3.6V 44QFN

PIC18LF45K22-I/ML

Manufacturer Part Number
PIC18LF45K22-I/ML
Description
MCU 8BIT 32KB FLASH 3.6V 44QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets

Specifications of PIC18LF45K22-I/ML

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-VQFN
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
1536Byte
Cpu Speed
64MHz
No. Of Timers
7
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
36
Number Of Timers
7
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 28 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
15.6.13.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user releases SDAx and the pin is allowed to
float high, the BRG is loaded with SSPxADD and
counts down to zero. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
FIGURE 15-36:
FIGURE 15-37:
 2010 Microchip Technology Inc.
A low level is sampled on SDAx when SCLx
goes from low level to high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
Preliminary
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’,
If SDAx is sampled high, the BRG is reloaded and
begins counting. If SDAx goes from high-to-low before
the BRG times out, no bus collision occurs because no
two masters can assert SDAx at exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition, see
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG
is reloaded and begins counting. At the end of the
count, regardless of the status of the SCLx pin, the
SCLx pin is driven low and the Repeated Start
condition is complete.
PIC18(L)F2X/4XK22
Figure
T
Cleared by software
BRG
15-36.
Interrupt cleared
by software
’0’
’0’
DS41412D-page 251
’0’
Figure
15-35).

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