PIC18LF1330-I/SO Microchip Technology, PIC18LF1330-I/SO Datasheet - Page 18
![IC PIC MCU FLASH 4KX16 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC18LF1330-I/SO
Manufacturer Part Number
PIC18LF1330-I/SO
Description
IC PIC MCU FLASH 4KX16 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.AC162078.pdf
(318 pages)
3.PIC18F1230-ISO.pdf
(6 pages)
4.PIC18F1230-ISO.pdf
(12 pages)
5.PIC18F1230-ISO.pdf
(4 pages)
6.PIC18F1230-IP.pdf
(312 pages)
Specifications of PIC18LF1330-I/SO
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
256Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF1330-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- AC162078 PDF datasheet #2
- PIC18F1230-ISO PDF datasheet #3
- PIC18F1230-ISO PDF datasheet #4
- PIC18F1230-ISO PDF datasheet #5
- PIC18F1230-IP PDF datasheet #6
- Current page: 18 of 318
- Download datasheet (3Mb)
PIC18F1230/1330
2.2
2.2.1
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A 0.1 F (100 nF),
• Placement on the printed circuit board: The
• Handling high-frequency noise: If the board is
• Maximizing performance: On the board layout
DS39758D-page 18
10-20V capacitor is recommended. The capacitor
should be a low-ESR device, with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 F in parallel with 0.001 F).
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
SS
, is required.
Power Supply Pins
DECOUPLING CAPACITORS
DD
, V
SS
, AV
DD
and
2.2.2
On boards with power traces running longer than
six inches in length, it is suggested to use a tank capac-
itor for integrated circuits, including microcontrollers, to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device, and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 F to 47 F.
2.2.3
When the Brown-out Reset (BOR) feature is enabled,
a sudden change in V
BOR event. This can happen when the microcontroller
is operating under normal operating conditions, regard-
less of what the BOR set point has been programmed
to, and even if V
The precipitating factor in these BOR events is a rise or
fall in V
An application that incorporates adequate decoupling
between the power supplies will not experience such
rapid voltage changes. Additionally, the use of an
electrolytic tank capacitor across V
described above, will be helpful in preventing high slew
rate transitions.
If the application has components that turn on or off,
and share the same V
the BOR can be disabled in software by using the
SBOREN bit before switching the component. After-
wards, allow a small delay before re-enabling the BOR.
By doing this, it is ensured that the BOR is disabled
during the interval that might cause high slew rate
changes of V
Note:
DD
with a slew rate faster than 0.15V/s.
TANK CAPACITORS
CONSIDERATIONS WHEN USING
BOR
Not all devices incorporate software BOR
control. See Section 5.0 “Reset” for
device-specific information.
DD
.
DD
does not approach the set point.
DD
DD
2009 Microchip Technology Inc.
may result in a spontaneous
circuit as the microcontroller,
DD
and V
SS
, as
Related parts for PIC18LF1330-I/SO
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![TC1014-2.7VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1014-5.0VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1055-2.5VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1055-2.7VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1055-2.8VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1055-4.0VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1186-2.5VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
![TC1186-2.85VCT](/images/manufacturer_photos/0/4/440/microchip_technology_inc__tmb.jpg)
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet: