DSPIC33FJ12MC202-I/SP Microchip Technology, DSPIC33FJ12MC202-I/SP Datasheet - Page 220
![IC DSPIC MCU/DSP 12K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ12MC202-I/SP
Manufacturer Part Number
DSPIC33FJ12MC202-I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.DSPIC33FJ12MC201-ISO.pdf
(288 pages)
3.DSPIC33FJ12MC201-ISO.pdf
(14 pages)
4.DSPIC33FJ12MC202-IML.pdf
(282 pages)
Specifications of DSPIC33FJ12MC202-I/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
12KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC24HJ12GP201-ISO PDF datasheet
- DSPIC33FJ12MC201-ISO PDF datasheet #2
- DSPIC33FJ12MC201-ISO PDF datasheet #3
- DSPIC33FJ12MC202-IML PDF datasheet #4
- Current page: 220 of 282
- Download datasheet (4Mb)
dsPIC33FJ12MC201/202
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70265C-page 218
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 20-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 20-pin SOIC
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 20-pin SSOP
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN
Note 1:
Characteristic
DC Characteristics
P
I/O = Σ ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
108
-40
-40
-40
-40
45
45
60
50
71
35
dsPIC33FJ12MC201/202
(T
© 2008 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
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