DSPIC33FJ12MC202-I/SP Microchip Technology, DSPIC33FJ12MC202-I/SP Datasheet - Page 265
![IC DSPIC MCU/DSP 12K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ12MC202-I/SP
Manufacturer Part Number
DSPIC33FJ12MC202-I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.DSPIC33FJ12MC201-ISO.pdf
(288 pages)
3.DSPIC33FJ12MC201-ISO.pdf
(14 pages)
4.DSPIC33FJ12MC202-IML.pdf
(282 pages)
Specifications of DSPIC33FJ12MC202-I/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
12KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC24HJ12GP201-ISO PDF datasheet
- DSPIC33FJ12MC201-ISO PDF datasheet #2
- DSPIC33FJ12MC201-ISO PDF datasheet #3
- DSPIC33FJ12MC202-IML PDF datasheet #4
- Current page: 265 of 282
- Download datasheet (4Mb)
© 2008 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
EXPOSED
E
Preliminary
A
NOTE 1
dsPIC33FJ12MC201/202
PAD
Units
A1
A3
E2
D2
D
N
A
E
K
e
b
L
E2
1
2
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
6.00 BSC
0.65 BSC
0.20 REF
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
28
D2
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
DS70265C-page 263
b
K
e
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