PIC18F2410-I/SO Microchip Technology, PIC18F2410-I/SO Datasheet - Page 315

IC MCU FLASH 8KX16 28SOIC

PIC18F2410-I/SO

Manufacturer Part Number
PIC18F2410-I/SO
Description
IC MCU FLASH 8KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2410-I/SO

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2410-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
25.2
© 2009 Microchip Technology Inc.
PIC18LF2X1X/4X1X
PIC18F2X1X/4X1X
ParamNo.
Legend:
Note 1:
(Industrial)
(Industrial, Extended)
2:
3:
4:
5:
DC Characteristics:
Power-down Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
For RC oscillator configurations, current through R
estimated by the formula Ir = V
Low-power Timer1 oscillator selected.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
Extended devices only
PIC18LF2X1X/4X1X
PIC18LF2X1X/4X1X
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All devices
DD
; WDT enabled/disabled as specified.
PD
DD
)
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Power-Down and Supply Current
PIC18F2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X (Industrial)
Typ
measurements in active operation mode are:
0.1
0.1
0.2
0.1
0.1
0.3
0.1
0.1
0.4
10
DD
/2R
EXT
Max
950
120
1.0
1.4
1.9
2.0
15
5
2
8
(mA) with R
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
nA
EXT
EXT
is not included. The current through the resistor can be
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
in kΩ.
PIC18F2X1X/4X1X
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
Conditions
DD
or V
SS
DD
;
and all features that
(Sleep mode)
(Sleep mode)
(Sleep mode)
DS39636D-page 317
V
V
V
DD
DD
DD
= 2.0V,
= 3.0V,
= 5.0V,

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