PIC18F2410-I/SO Microchip Technology, PIC18F2410-I/SO Datasheet - Page 357

• Manufacturer Part Number: PIC18F2410-I/SO
• Description: IC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2410-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: CCP, ECCP, EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2009 Microchip Technology Inc.
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
D2
A1
A3
E2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
PIC18F2X1X/4X1X
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
DS39636D-page 359
K
e
b