PIC18F452-I/PG Microchip Technology, PIC18F452-I/PG Datasheet - Page 312
![IC MCU FLASH 16KX16 W/AD 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F452-I/PG
Manufacturer Part Number
PIC18F452-I/PG
Description
IC MCU FLASH 16KX16 W/AD 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18LF242-ISO.pdf
(36 pages)
Specifications of PIC18F452-I/PG
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
For Use With
ACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F242-ISO PDF datasheet #2
- PIC18F242-ISO PDF datasheet #3
- PIC18F242-ISO PDF datasheet #4
- PIC18F242-ISO PDF datasheet #5
- PIC18F242-ISO PDF datasheet #6
- PIC18LF242-ISO PDF datasheet #7
- Current page: 312 of 332
- Download datasheet (6Mb)
PIC18FXX2
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39564C-page 310
Note:
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-076
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
D1
n1
E1
A1
D
B
n
p
A
L
F
E
c
n
MIN
.004
.039
.037
.002
.018
.463
.463
.390
.390
.012
.025
2
1
0
5
5
D1
L
.039 REF.
CH x 45°
INCHES
D
NOM
.031
44
11
.043
.039
.004
.024
.472
.472
.394
.394
.006
.015
.035
A1
3.5
10
10
A
F
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.30
0.64
0.09
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
1.10
1.00
0.10
0.60
0.15
0.38
0.89
Revised 07-22-05
3.5
10
10
0.80
44
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7
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