PIC18F4455-I/P Microchip Technology, PIC18F4455-I/P Datasheet - Page 6

• Manufacturer Part Number: PIC18F4455-I/P
• Description: IC PIC MCU FLASH 12KX16 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4455-I/P

• Program Memory Type: FLASH
• Program Memory Size: 24KB (12K x 16)
• Package / Case: 40-DIP (0.600", 15.24mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 35
• Eeprom Size: 256 x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SPI/I2C/EAUSART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163025
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 10-bit
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 48 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDDVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2455/2550/4455/4550
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 111
11.0 Timer0 Module ......................................................................................................................................................................... 125
12.0 Timer1 Module ......................................................................................................................................................................... 129
13.0 Timer2 Module ......................................................................................................................................................................... 135
14.0 Timer3 Module ......................................................................................................................................................................... 137
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 141
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 149
17.0 Universal Serial Bus (USB) ...................................................................................................................................................... 163
18.0 Streaming Parallel Port ............................................................................................................................................................ 187
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 193
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 237
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 259
22.0 Comparator Module.................................................................................................................................................................. 269
23.0 Comparator Voltage Reference Module ................................................................................................................................... 275
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 279
25.0 Special Features of the CPU .................................................................................................................................................... 285
26.0 Instruction Set Summary .......................................................................................................................................................... 307
27.0 Development Support............................................................................................................................................................... 357
28.0 Electrical Characteristics .......................................................................................................................................................... 361
29.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 399
30.0 Packaging Information.............................................................................................................................................................. 401
Appendix A: Revision History............................................................................................................................................................. 409
Appendix B: Device Differences......................................................................................................................................................... 409
Appendix C: Conversion Considerations ........................................................................................................................................... 410
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 410
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 411
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 411
Index .................................................................................................................................................................................................. 413
The Microchip Web Site ..................................................................................................................................................................... 425
Customer Change Notification Service .............................................................................................................................................. 425
Customer Support .............................................................................................................................................................................. 425
Reader Response .............................................................................................................................................................................. 426
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 427
DS39632C-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 43
Memory Organization ................................................................................................................................................................. 57
Flash Program Memory .............................................................................................................................................................. 79
Data EEPROM Memory ............................................................................................................................................................. 89
8 x 8 Hardware Multiplier............................................................................................................................................................ 95
Interrupts .................................................................................................................................................................................... 97
Preliminary
© 2006 Microchip Technology Inc.