DSPIC30F5015-30I/PT Microchip Technology, DSPIC30F5015-30I/PT Datasheet - Page 39

• Manufacturer Part Number: DSPIC30F5015-30I/PT
• Description: IC DSPIC MCU/DSP 66K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5015-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 66KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F501530IPT

4.2.1
The Modulo Addressing scheme requires that a
starting and an ending address be specified and
loaded into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
The length of a circular buffer is not directly specified. It
is
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
FIGURE 4-1:
© 2007 Microchip Technology Inc.
Note:
Byte
Address
0x1100
0x1163
determined by the difference
START AND END ADDRESS
Y-space Modulo Addressing EA calcula-
tions assume word-sized data (LSb of
every EA is always clear).
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
MODULO ADDRESSING OPERATION EXAMPLE
between
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN: INC
the
#0x1100,W0
W0, XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0, [W1++]
W0,W0
4.2.2
The Modulo and Bit-Reversed Addressing Control reg-
ister, MODCON<15:0>, contains enable flags, as well
as a W register field to specify the W Address registers.
The XWM and YWM fields select which registers will
operate with Modulo Addressing. If XWM = 15,
X RAGU and X WAGU Modulo Addressing are
disabled. Similarly, if YWM = 15, Y AGU Modulo
Addressing is disabled.
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than 15
and the YMODEN bit is set at MODCON<14>.
dsPIC30F5015/5016
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
W ADDRESS REGISTER
SELECTION
DS70149C-page 37