DSPIC30F6010T-30I/PF Microchip Technology, DSPIC30F6010T-30I/PF Datasheet - Page 59

• Manufacturer Part Number: DSPIC30F6010T-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6010T-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• For Use With: DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F6010T30IP

TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC CHARACTERISTICS
P9b
P10
P11
P12a
P12b
P13a
P13b
Param.
No.
T
T
T
T
T
T
T
ERA
ERA
DLY
DLY
DLY
PROG
PROG
Sym
5
6
7
AC/DC CHARACTERISTICS (CONTINUED)
Delay between PGD ↓ by programming
executive to PGD released by
programming executive
Delay between PGD released by
programming executive to first PGC ↑ of
response
Delay between clocking out response
words
Row Programming cycle time
Row Programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
0.8
0.8
15
10
5
1
1
Max
2.6
2.6
—
—
—
4
4
Units
ms
ms
ms
ms
μs
μs
μs
DS70102K-page 59
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—