LPC1111FHN33/101,5 NXP Semiconductors, LPC1111FHN33/101,5 Datasheet - Page 56
![IC MCU 32BIT 8KB FLASH 33HVQFN](/photos/6/51/65170/568-32-hvqfn_sml.jpg)
LPC1111FHN33/101,5
Manufacturer Part Number
LPC1111FHN33/101,5
Description
IC MCU 32BIT 8KB FLASH 33HVQFN
Manufacturer
NXP Semiconductors
Series
LPC1100r
Datasheets
1.LPC1114FHN333015.pdf
(2 pages)
2.LPC1114FHN333015.pdf
(66 pages)
3.LPC1114FHN333015.pdf
(66 pages)
Specifications of LPC1111FHN33/101,5
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Package
33HVQFN EP
Device Core
ARM Cortex M0
Family Name
LPC1100
Maximum Speed
50 MHz
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4957
935290771551
935290771551
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
11.3 XTAL Printed Circuit Board (PCB) layout guidelines
Table 19.
Table 20.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
Fundamental oscillation
frequency F
Fundamental oscillation
frequency F
15 MHz - 20 MHz
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
20 MHz - 25 MHz
1 MHz - 5 MHz
Fig 31. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
Recommended values for C
components parameters) low frequency mode
Recommended values for C
components parameters) high frequency mode
OSC
OSC
All information provided in this document is subject to legal disclaimers.
XTALIN
C X1
LPC1xxx
Rev. 4 — 10 February 2011
XTAL
X1
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Crystal load
capacitance C
10 pF
20 pF
10 pF
20 pF
/C
X2
XTALOUT
evaluation
C X2
X1
X1
/C
/C
L
L
X2
X2
in oscillation mode (crystal and external
in oscillation mode (crystal and external
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
Maximum crystal
series resistance R
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
=
x1
S
S
, C
L
C L
R S
x2
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
002aaf424
, and C
© NXP B.V. 2011. All rights reserved.
C P
x3
in case of
X1
X1
, C
, C
56 of 66
X2
X2