STM32F102RBT6 STMicroelectronics, STM32F102RBT6 Datasheet - Page 27

• Manufacturer Part Number: STM32F102RBT6
• Description: MCU ARM 32BIT 128KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F102RBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-8312

STM32F102x8, STM32F102xB
5.3
5.3.1
5.3.2
Operating conditions
General operating conditions
Table 8.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Operating conditions at power-up / power-down
Subject to general operating conditions for T
Table 9.
Symbol
Symbol
V
between V
characteristics on page
Table 6.2: Thermal characteristics on page
f
f
t
f
PCLK1
PCLK2
V
VDD
DDA
HCLK
V
P
T
T
BAT
DD
A
A
D
J
is lower, higher P
(1)
V
V
DD
General operating conditions
Operating conditions at power-up / power-down
DD
DD
Internal APB1 clock frequency
Internal APB2 clock frequency
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Power dissipation at T
85 °C
Ambient temperature
Junction temperature range
Internal AHB clock frequency
and V
Standard operating voltage
Backup operating voltage
rise time rate
fall time rate
Parameter
(3)
DDA
D
Parameter
65).
can be tolerated during power-up and operation.
values are allowed as long as T
DD
A
Table 44: ADC
and V
can be extended to this range as long as T
Doc ID 15056 Rev 3
A
=
DDA
65).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP48
LQFP64
Maximum power dissipation
Low power dissipation
A
Conditions
.
DD
J
(2)
does not exceed T
Conditions
(4)
J
J
max (see
Electrical characteristics
does not exceed T
Min
Min
–40
20
–40
–40
2.4
1.8
0
0
0
0
2
2
Table 6.2: Thermal
Max
363
444
105
105
3.6
3.6
3.6
3.6
48
24
48
85
Max


J
max (see
MHz
Unit
mW
°C
°C
°C
Unit
µs/V
V
V
V
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