S9S08SG4E2CSC Freescale Semiconductor, S9S08SG4E2CSC Datasheet - Page 313
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
S9S08SG4E2CSC
Manufacturer Part Number
S9S08SG4E2CSC
Description
MCU 4K FLASH 8-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG4E2CSC.pdf
(316 pages)
Specifications of S9S08SG4E2CSC
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
4
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
On-chip Dac
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08SG8 and MC9S08SG4 devices.
B.1.1
B.2
Table B-2
outline/mechanical drawings are available on the MC9S08SG8 Series Product Summary pages at
http://www.freescale.com.
Freescale Semiconductor
Core
SG Family
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
1
2
See
See
Device Number
S9S08SG8
S9S08SG4
Table 1-1
Table B-2
Package Information and Mechanical Drawings
Ordering Information
provides the available package types and their document numbers. The latest package
Device Numbering Scheme
for a complete description of modules included on each device.
for package information.
1
S
FLASH
9
8K
4K
S08
MC9S08SG8 MCU Series Data Sheet, Rev. 6
Table B-1. Device Numbering System
Memory
Memory Size
- 8 Kbytes
- 4 Kbytes
SG 8
RAM
512
256
E2
C
20 TSSOP
20-Pin
TJ
R
Available Packages
16 TSSOP
16-Pin
Tape and Reel Suffix (optional)
Temperature Option
- C = -40 to 85 °C
- V = -40 to 105 °C
- M = -40 to 125 °C
Package Designator
Two letter descriptor
(refer to
Mask Set Identifier
- Alpha character references
- Numeric character identifies
wafer fab.
mask.
Table
2
8 NB SOIC
B-2).
8-Pin
313
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