MC9S08QE8CLC Freescale Semiconductor, MC9S08QE8CLC Datasheet - Page 9

• Manufacturer Part Number: MC9S08QE8CLC
• Description: IC MCU 8BIT 8K FLASH 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE8CLC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 26
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 10-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• Package: 32LQFP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3 V
• For Use With: DEMO9S08QE8 - BOARD DEMO FOR MC9S08Q
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

The average chip-junction temperature (T
where:
T

P
P
P
For most applications, P
(if P
Solving
Freescale Semiconductor
JA
A
D
int
I/O
= Ambient temperature, C
= P
= Package thermal resistance, junction-to-ambient, C/W
= I
I/O
= Power dissipation on input and output pins — user determined
int
DD
is neglected) is:
Equation 1
P
 V
I/O
DD
, Watts — chip internal power
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and
Single-layer board
Four-layer board
I/O
Equation 2
32-pin QFN
32-pin LQFP
28-pin SOIC
20-pin SOIC
16-pin PDIP
16-pin TSSOP
32-pin QFN
32-pin LQFP
28-pin SOIC
20-pin SOIC
16-pin PDIP
16-pin TSSOP
 P
Rating
int
K = P
and can be neglected. An approximate relationship between P
MC9S08QE8 Series Data Sheet, Rev. 8
for K gives:
Table 4. Thermal Characteristics
D
P
 (T
T
D
J
J
= K  (T
) in C can be obtained from:
= T
A
+ 273 C) + 
A
+ (P
J
+ 273 C)
D
Symbol
 
T


T
JM
JA
JA
JA
A
JA
)
 (P
D
)
2
–40 to 85
T
Value
L
110
108
95
66
57
71
64
42
47
42
52
47
78
to T
H
C/W
C/W
Electrical Characteristics
Unit
C
C
D
and T
Eqn. 1
Eqn. 2
Eqn. 3
J
9