MC9S08RD32CDWE Freescale Semiconductor, MC9S08RD32CDWE Datasheet - Page 163

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MC9S08RD32CDWE

Manufacturer Part Number
MC9S08RD32CDWE
Description
IC MCU 32K FLASH 2K RAM 28-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32CDWE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
S08RD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

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Chapter 13
Serial Peripheral Interface (S08SPIV3)
are shared with PTC4-PTC7 port pins. When the SPI is enabled these pins are controlled by the SPI
module.
Freescale Semiconductor
The SPI is only available on the MC9S08RGxx versions of this family of microcontrollers. The SPI pins
EXTAL
NOTES:
XTAL
V
V
1. Port pins are software configurable with pullup device if input port
2. PTA0 does not have a clamp diode to VDD. PTA0 should not be driven above VDD. Also, PTA0 does not pullup to VDD when internal
3. IRQ pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1)
4. The RESET pin contains integrated pullup device enabled if reset enabled (RSTPE = 1)
5. High current drive
6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown enabled when KBI is enabled (KBIPEn = 1) and rising edge is
DD
SS
pullup is enabled.
selected (KBEDGn = 1).
(RC/RD/RE/RG32/60 = 2048 BYTES)
(RC/RD/RE/RG60 = 63,364 BYTES)
(RC/RD/RE/RG32 = 32,768 BYTES)
(RC/RD/RE8/16 = 1024 BYTES)
(RC/RD/RE16 = 16,384 BYTES)
Figure 13-1. MC9S08RC/RD/RE/RG Block Diagram Highlighting SPI Block and Pins
LOW-POWER OSCILLATOR
(RC/RD/RE8 = 8192 BYTES)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
BDC
POWER MANAGEMENT
IRQ
RTI
HCS08 CORE
USER FLASH
REGULATOR
USER RAM
VOLTAGE
CPU
COP
LVD
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
INTERRUPT MODULE (KBI1)
INTERRUPT MODULE (KBI2)
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SPI1)
2-CHANNEL TIMER/PWM
ANALOG COMPARATOR
CARRIER MODULATOR
TIMER MODULE (CMT)
SERIAL PERIPHERAL
MODULE (ACMP1)
8-BIT KEYBOARD
4-BIT KEYBOARD
MODULE (TPM1)
MODULE (DBG)
DEBUG
INTERNAL BUS
7
8
IRO NOTE 5
PTC7/SS1
PTC6/SPSCK1
PTC5/MISO1
PTC4/MOSI1
PTC3/KBI2P3
PTC2/KBI2P2
PTC1/KBI2P1
PTC0/KBI2P0
PTA7/KBI1P7–
PTA1/KBI1P1
PTA0/KBI1P0
PTE7–
PTB7/TPM1CH1
PTE6
PTB5
PTB4
PTB3
PTB2
PTB1/RxD1
PTB0/TxD1
PTD6/TPM1CH0
PTD5/ACMP1+
PTD4/ACMP1–
PTD3
PTD2/IRQ
PTD1/RESET
PTD0/BKGD/MS
PTE0
NOTE 1
NOTES1, 2
NOTES 1, 5
NOTE 1
NOTES
1, 3, 4
163

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