MC9S08RD32CDWE Freescale Semiconductor, MC9S08RD32CDWE Datasheet - Page 17

• Manufacturer Part Number: MC9S08RD32CDWE
• Description: IC MCU 32K FLASH 2K RAM 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08RD32CDWE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: S08RD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08RG60E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

1.3
This block diagram shows the structure of the MC9S08RC/RD/RE/RG MCUs
Table 1-2
Freescale Semiconductor
EXTAL
XTAL
NOTES:
V
V
DD
SS
1. Port pins are software configurable with pullup device if input port
2. PTA0 does not have a clamp diode to V
3. IRQ pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1)
4. The RESET pin contains integrated pullup device enabled if reset enabled (RSTPE = 1)
5. High current drive
6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown enabled when KBI is enabled (KBIPEn = 1) and
V
rising edge is selected (KBEDGn = 1).
MCU Block Diagram
lists the functional versions of the on-chip modules.
DD
(RC/RD/RE/RG32/60 = 2048 BYTES)
(RC/RD/RE/RG60 = 63,364 BYTES)
(RC/RD/RE/RG32 = 32,768 BYTES)
(RC/RD/RE8/16 = 1024 BYTES)
when internal pullup is enabled.
(RC/RD/RE16 = 16,384 BYTES)
LOW-POWER OSCILLATOR
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
(RC/RD/RE8 = 8192 BYTES)
MODES OF OPERATION
POWER MANAGEMENT
BDC
IRQ
RTI
HCS08 CORE
REGULATOR
USER FLASH
USER RAM
VOLTAGE
COP
CPU
LVD
Figure 1-1. MC9S08RC/RD/RE/RG Block Diagram
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
DD
INTERFACE MODULE (SCI1)
INTERRUPT MODULE (KBI1)
INTERRUPT MODULE (KBI2)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SPI1)
. PTA0 should not be driven above V
2-CHANNEL TIMER/PWM
ANALOG COMPARATOR
CARRIER MODULATOR
TIMER MODULE (CMT)
SERIAL PERIPHERAL
MODULE (ACMP1)
8-BIT KEYBOARD
4-BIT KEYBOARD
MODULE (TPM1)
MODULE (DBG)
DEBUG
INTERNAL BUS
DD
. Also, PTA0 does not pullup to
7
8
IRO NOTE 5
PTC7/SS1
PTC6/SPSCK1
PTC5/MISO1
PTC4/MOSI1
PTC3/KBI2P3
PTC2/KBI2P2
PTC1/KBI2P1
PTC0/KBI2P0
PTA7/KBI1P7–
PTA1/KBI1P1
PTA0/KBI1P0
PTE7–
PTB7/TPM1CH1
PTE6
PTB5
PTB4
PTB3
PTB2
PTB1/RxD1
PTB0/TxD1
PTD6/TPM1CH0
PTD5/ACMP1+
PTD4/ACMP1–
PTD3
PTD2/IRQ
PTD1/RESET
PTD0/BKGD/MS
PTE0
NOTE 1
Introduction
NOTES1, 2, 6
NOTES 1, 5
NOTE 1
NOTES
1, 3, 4
17