MCF51CN128CGT Freescale Semiconductor, MCF51CN128CGT Datasheet - Page 13

• Manufacturer Part Number: MCF51CN128CGT
• Description: IC MCU 32BIT 128K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: MCF51CNr

Specifications of MCF51CN128CGT

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: Ethernet, I²C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: MCF51CN
• Core: ColdFire V1
• Data Bus Width: 32 bit
• Data Ram Size: 24 KB
• Interface Type: I2C, SPI, SCI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 38
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: TWR-MCF51CN-KIT, TWR-SER, TWR-ELEV, TOWER
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 12 Channel
• For Use With: TWR-MCF51CN - KIT TOWER BOARDTWR-MCF51CN-KIT - KIT TOWER BOARD/SERIAL/ELEVATOR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.4
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
the difference between actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
is:
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring P
for a known T
for any value of T
Freescale Semiconductor
Equation 1
T
θ
P
P
P
JA
A
D
int
I/O
Thermal Characteristics
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
A
. Using this value of K, the values of P
int
DD
A
1
+ P
.
× V
and
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
Depending on device.
I/O
Single-layer board
Four-layer board
DD
I/O
Equation 2
, Watts — chip internal power
<< P
48-pin QFN
64-pin LQFP
80-pin LQFP
48-pin QFN
64-pin LQFP
80-pin LQFP
int
MCF51CN128 ColdFire Microcontroller Data Sheet, Rev. 4
and can be neglected. An approximate relationship between P
Rating
for K gives:
K = P
J
) in °C can be obtained from:
Table 5. Thermal Characteristics
D
P
SS
T
× (T
D
J
or V
= K ÷ (T
= T
A
D
+ 273°C) + θ
and T
A
DD
+ (P
and multiply by the pin current for each I/O pin. Except in cases of
J
J
+ 273°C)
can be obtained by solving
D
Symbol
× θ
T
θ
θ
T
JM
JA
JA
A
JA
JA
)
× (P
(–40 to 85 or 0 to 70)
D
I/O
)
2
into account in power calculations, determine
T
Value
SS
L
95
81
26
69
60
50
47
to T
or V
H
Equation 1
DD
will be very small.
1
D
and T
Electrical Characteristics
and
°C/W
°C/W
Unit
°C
°C
J
Equation 2
(if P
D
I/O
(at equilibrium)
is neglected)
iteratively
Eqn. 1
Eqn. 2
Eqn. 3
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