MC9S08LL36CLK Freescale Semiconductor, MC9S08LL36CLK Datasheet - Page 2

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MC9S08LL36CLK

Manufacturer Part Number
MC9S08LL36CLK
Description
IC MCU 8BIT 36KB FLASH 80LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r

Specifications of MC9S08LL36CLK

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
36KB (36K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Processor Series
S08LL
Core
HCS08
3rd Party Development Tools
EWS08
Development Tools By Supplier
TWR-SER, TWR-ELEV, TWR-S08LL64, TWR-SENSOR-PAK, TWR-S08LL64-KIT, TWR-LCD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08LL36CLK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
Contents
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will
be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
Related Documentation
Find the most current versions of all documents at:
2
Reference Manual — MC9S08LL64RM
Devices in the MC9S08LL64 Series. . . . . . . . . . . . . . . . . . . . . 3
Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
http://freescale.com/
Rev
1
2
3
4
5
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Parameter Classification. . . . . . . . . . . . . . . . . . . . . . . . . 9
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD Protection and Latch-Up Immunity . . . . . . . . . . . . 11
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply Current Characteristics. . . . . . . . . . . . . . . . . . . 23
External Oscillator (XOSCVLP) Characteristics . . . . . . 24
Internal Clock Source (ICS) Characteristics . . . . . . . . . 26
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 28
01/2009
03/2009
08/2009
7/2008
1/2010
Date
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
Intial Release of the electrical characteristics in the Reference Manual.
Initial Release after product redefinition and restructuring of information into a separate Data
Sheet and Reference Manual.
Incorporated revisions for customer release.
Completed all the TBDs.
Corrected Pin out in the
Updated V
Updated
Updated ERREFSTEN and added LCD in the
Updated f
Updated V Room Temp in the
Added 80-pin LQFP package information for MC9S08LL36.
MC9S08LL64 Series MCU Data Sheet, Rev. 5
Table
ADACK
OH
, |I
9.
In
, E
|, |I
TUE
OZ
, DNL, INL, E
|, R
Figure
PU
, R
Table
http://www.freescale.com
2,
PD
4
Figure 3
, added |I
Description of Changes
ZS
19.
3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .33
3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .33
3.13 VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.14 LCD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.15 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.16 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
4.1
4.2
4.3
and E
3.10.2 TPM Module Timing. . . . . . . . . . . . . . . . . . . . . .29
3.10.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .40
Device Numbering System . . . . . . . . . . . . . . . . . . . . . .41
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .41
and
INT
FS
Table
| in the
Table
in the
10.
2.
Table
Table
18.
8.
Freescale Semiconductor

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